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Production technology - thin film layers

TESLA BLATNA runs thin and thick film technologies in clean rooms class ISO 7 and 8 according to ČSN ISO 14644-1. The pilot line is equipped with sputtering and evaporation machines, equipment for photolithography, laser trimming system, diamond saw for cutting alumina and silicon substrates, sophisticated screen printer, and other machines.

Technological background and possibilities of custom-tailored production

Sputtering

Sputtering


The deposition process is standardly applied to sputtering metal films of gold, platinum, tantalum, nickel-chromium, titanium and tungsten on alumina, silicon and flexible substrates like Kapton. Standard alumina substrate dimensions are 4 inch by 4 inch (101.4 mm by 101.4 mm).


Photolithography

Photolithography


Thin film structures are fabricated using standard photoresist mask, wet and dry chemical etching in special cases using lift-off procedure. Standardly attained line/gap widths: down to 0.2 mils (5 µm). The customer’s design is transferred into chromium masks that are used for photo-imaging process. The masks layout respects the process needs.


Paste dispenser

Paste dispenser


The dispenser system is designed for precise deposition of conductive or dielectric pastes. It is used for wire contacts fixing, thickening contact pads, etc.


Laser trimmer

Laser trimmer


The sophisticated laser trimming system is used for testing and trimming thin film resistors and different thin film applications. The 3 W Q-switched YAG green laser beam using wave length of 532 nm evaporates readily thin metal film. The laser beam can be focused very exactly to create cut exhibiting width down to 0.5 mil (12.5 µm). The system can trim resistors in the resistance range of 0.1 Ω to 1000 M Ω. The precision of trimming down to 0.02% depending on the resistance value.


Screen printer

Screen printer


The printer is used for selective deposition of conductive, resistive and dielectric pastes on alumina, glass and flexible substrates. The resolution of the process enables line/gap width down to 50 μm or even better.


Leads welder

Leads welder


The machine makes spot welds to attach wire leads of 0.2 to 0.3 mm diameter and 10 to 100 mm length to thin and thick film contact pads.


Diamond saw

Diamond saw


The diamond dicing saw can cut alumina and silicon substrates up to the dimensions 4 inch by 4 inch.



Further technologies


Electroplating nickel and gold, wet deposition processes, testing procedures.


Product examples

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Laser cuts on the pattern
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Microwave circuit I.
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Microwave circuit II.
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Pt temperature sensors
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Printed interdigital electrodes on Kapton foil
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Sputtered electrochemical platform
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Eatched hole in bronze foil with Ni layer